JPH0412697Y2 - - Google Patents

Info

Publication number
JPH0412697Y2
JPH0412697Y2 JP1985091774U JP9177485U JPH0412697Y2 JP H0412697 Y2 JPH0412697 Y2 JP H0412697Y2 JP 1985091774 U JP1985091774 U JP 1985091774U JP 9177485 U JP9177485 U JP 9177485U JP H0412697 Y2 JPH0412697 Y2 JP H0412697Y2
Authority
JP
Japan
Prior art keywords
emitting diode
light emitting
lead wire
solder
diode lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985091774U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61207051U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985091774U priority Critical patent/JPH0412697Y2/ja
Publication of JPS61207051U publication Critical patent/JPS61207051U/ja
Application granted granted Critical
Publication of JPH0412697Y2 publication Critical patent/JPH0412697Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1985091774U 1985-06-18 1985-06-18 Expired JPH0412697Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985091774U JPH0412697Y2 (en]) 1985-06-18 1985-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985091774U JPH0412697Y2 (en]) 1985-06-18 1985-06-18

Publications (2)

Publication Number Publication Date
JPS61207051U JPS61207051U (en]) 1986-12-27
JPH0412697Y2 true JPH0412697Y2 (en]) 1992-03-26

Family

ID=30647959

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985091774U Expired JPH0412697Y2 (en]) 1985-06-18 1985-06-18

Country Status (1)

Country Link
JP (1) JPH0412697Y2 (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012156294A (ja) * 2011-01-26 2012-08-16 Nichia Chem Ind Ltd 半導体装置

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3685057B2 (ja) * 1999-12-08 2005-08-17 日亜化学工業株式会社 Ｌｅｄランプ及びその製造方法
JP2005184033A (ja) * 1999-12-08 2005-07-07 Nichia Chem Ind Ltd Ｌｅｄランプ及びその製造方法
JP4656927B2 (ja) * 2004-12-10 2011-03-23 スタンレー電気株式会社 Ｌｅｄ
JP5611867B2 (ja) * 2011-03-09 2014-10-22 スタンレー電気株式会社 光半導体装置およびその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5179569A (ja) * 1975-01-06 1976-07-10 Hitachi Ltd Riidofureemu
GB1584712A (en) * 1976-09-10 1981-02-18 Hauni Werke Koerber & Co Kg Conveying apparatus
JPS5839046A (ja) * 1981-08-31 1983-03-07 Rohm Co Ltd 電子部品
JPS5918691U (ja) * 1982-07-29 1984-02-04 株式会社シマノ 変速操作装置
JPS60123047A (ja) * 1983-12-07 1985-07-01 Toshiba Corp 半導体装置
JPH0742530B2 (ja) * 1986-08-15 1995-05-10 株式会社高純度化学研究所 低酸素合金成形体の製造法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012156294A (ja) * 2011-01-26 2012-08-16 Nichia Chem Ind Ltd 半導体装置

Also Published As

Publication number Publication date
JPS61207051U (en]) 1986-12-27

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